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The E-Sylum: Volume 18, Number 12, March 22, 2015, Article 25

2015 WORLD MONEY FAIR TECHNICAL FORUM

Not to be confused with the American Numismatic Association's "World's Fair of Money", the annual World Money Fair is a trade expo for the coin manufacturing industry - wall-to-wall with engineers and managers from the world's mints and their suppliers. Ursula Kampmann attended the recent event and filed a report in the March 19, 2015 issue of Coins Weekly. Below is list of talks from the Fair's Technical Forum. See her complte article online for more information. Sounds like a fun event for the true coin geeks among us. -Editor

2015 World Money Fair Technical Forum Technicians from 21 companies, 18 talks thematically grouped into 9 units, and countless representatives of national mints. That was the Thursday afternoon programme at the World Money Fair. Dieter Merkle (Schuler Pressen) and Thomas Hogenkamp (Spaleck) once again put together a true tour de force showing off the minting industry’s latest innovations. Since each and every talk demanded undivided attention from its audience, the afternoon programme, which came to an end with a slight delay, left its listeners exhausted.

Ross MacDiarmid, Royal Australian Mint: Silver Blanks

Dr Gerd Wagner, GmbH: hd-pro blanks

Aziya Ibrayeva, Kazakhstan Mint: Study of impact of crystallization parameters (conditions) of the AgCu 92.5 alloy ingots on surface quality of proof quality coin blanks

Stuart Wilson, The Royal Mint: Coin security: The technical challenges of designing and introducing a new, high value, high profile coin

2014 National Baseball Hall of Fame commemorative coins

Ronald E. Harrigal, US-Mint: Manufacturing Curved Collector Coins in High Volume

Loic Pollet, Velec and Thabo Nikitseng, South Africa Mint: SA Mint Fully Automatic Packing Line

Markus Schlein / Sack & Kiesselbach, Enhanced Feeding Solutions in the Numismatic Coin Production Area

Hermann Schürer, Economa, New highspeed precision weight checker for blanks and coins

Siemowit Kalukiewicz, Mint of Poland – Most technically advanced 3Dimension coins

Alicona, Optical 3 D micro coordinate system Mühlbauer's CCI Edge Inspect

Alfred Gnadenberger, Austrian Mint, and Christian Janko, Alicona, Optical 3 D micro coordinate system for form and roughness measurement and its use in minting

Romain Waidelich, Miba Coating Group, Environmental and working safety aspects of the PVD coating technology vs. galvanic technology

Volker von der Heide, Oerlikon-Metaplas GmbH, The New PVD HI3-Technology – Latest Developments and Potential for Coining Dies.

Robert Newman und Timothy Buch, DELCAM – ArtCAM, Pushing the boundaries of visual security

Ralf Freiberger, Mühlbauer, Coin edge inspection – how to integrate in automatic, high throughput processes

sorting machine from InduVis coloured coins produced by using nano technology

Lutz Büker, InduVis und Simon Watterton, INEA, New solutions in the inspection of blanks

Paolo Mascioli and Massimo Bersani, IPZS, Stress analysis of the working dies

Dr. Xianyao Li, Royal Canadian Mint, Nano technology for minting applications

Paul Smith, Acsys, Modern Coin Design: New Perspectives and Reflections

To read the complete article, see:
Visiting the Technical Forum at the 2015 World Money Fair (www.coinsweekly.com/en/News/4?&id=3320)



Wayne Homren, Editor

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